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What are the commonly used methods for measuring the thermal conductivity of thermal conductive silicone film?

Hello OP, the expert in thermal management solutions for GLPOLY thermal conductive materials around you, Wan Huai, will answer for you: The thermal conductivity of thermal conductive silicone film is the most important performance parameter of thermal conductive silicone film, and it is also the performance parameter that customers are most concerned about and want to know. However, most customers are not very familiar with the methods for measuring the thermal conductivity of thermal conductive silicone film (www.glpoly. com. cn). At present, there are three mainstream methods for testing thermal conductivity and thermal performance in the thermal conductive silicone film industry: Hot Plate method/Heat Flow Meter method, Laser Flash method, and Hot Disk (TPS technology). Here is a brief introduction and comparison of these three testing methods for everyone. 1. The steady-state method of Hot Plate/Heat Flow Meter is based on the Fourier heat transfer equation calculation method: dQ=- λ dA · dt/dn, where Q - represents thermal conductivity rate, w; A - represents thermal conductivity area, m2; dt/dn - represents temperature gradient, K/m; λ - thermal conductivity, w/m·K; During the testing process, a certain amount of heat flow is applied to the sample, and the thickness of the sample and the temperature difference between the hot and cold plates are tested to obtain the thermal conductivity of the sample. During the testing process, the sample needs to be a large block of conventional shaped baffle liquid to obtain sufficient temperature difference. Error source: The samples in the hot/cold plates

were not well protected, resulting in some heat loss. The temperature measuring element is a thermocouple, which takes into account the interface influence of the gap between the hot plate and the cold plate. The first source of error makes this method unsuitable for samples with a thermal conductivity greater than 2W/mK, as the heat loss is too high and the error increases with higher temperatures. The second source of error is actually taking into account the contact thermal resistance, resulting in a large temperature difference and a lower measured thermal conductivity. In addition, this method can only provide data on thermal conductivity with an accuracy of 5%. 2. Laser Flash transient method, which uses a laser beam to hit the surface of the sample and measures the temperature change on the lower surface with an infrared detector. The actual measured data is the thermal diffusivity of the sample. By comparing it with the standard sample, the density and specific heat of the sample are obtained, and Cp=λ/H, H - - thermal diffusivity coefficient is calculated, m2/s; λ - thermal conductivity, w/m·K; Cp - specific heat by volume, J/m3·K， And calculate the thermal conductivity of the sample through data analysis. The advantages of this test method are fast, non-contact, suitable for high temperature, high thermal conductivity samples, but not suitable for multi-layer structures, coatings, foam, liquids, anisotropic materials, etc. The reason is that the laser method tests the thermal diffusivity, and the mathematical model is based on isotropic materials. If it is a multi-layer structure, coating, or sample with absorption/radiation, there will be a significant deviation in the measured specific heat of the sample. In

What are the commonly used methods for measuring the thermal conductivity of thermal conductive silicone film?

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